Bare-die smart bridge connected with copper pillars for system-in-package apparatus

US11270941B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Georg Seidemann · Landshut, DE
• Thomas Wagner · Regelsbach, DE
• Andreas Wolter · Regensburg, DE
• Bernd Waidhas · Nittendorf, DE

Key dates

• Filing date: Dec 29, 2016
• Grant date: Mar 8, 2022
• Expiry date: Apr 8, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/15311
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A system-in-package apparatus includes a semiconductive bridge that uses bare-die pillars to couple with a semiconductive device such as a processor die. The apparatus achieves a thin form factor.