Method for manufacturing an optical sensor and optical sensor

US11271134B2 · kind B2 · utility

Assignee

• AMS AG · AT

Inventors

• Gregor Toschkoff · Graz, AT
• Thomas Bodner · Seiersberg, AT
• Franz Schrank · Graz, AT
• Miklos Labodi · Graz, AT
• Joerg Siegert · Graz, AT
• Martin Schrems · Langenbruck, DE

Key dates

• Filing date: Oct 15, 2018
• Grant date: Mar 8, 2022
• Expiry date: Oct 15, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F77/933
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method for manufacturing an optical sensor is provided. The method comprises providing an optical sensor arrangement which comprises at least two optical sensor elements on a carrier, where the optical sensor arrangement comprises a light entrance surface at the side of the optical sensor elements facing away from the carrier. The method further comprises forming a trench between two optical sensor elements in a vertical direction which is perpendicular to the main plane of extension of the carrier, where the trench extends from the light entrance surface of the sensor arrangement at least to the carrier. Moreover, the method comprises coating the trench with an opaque material, forming electrical contacts for the at least two optical sensor elements on a back side of the carrier facing away from the optical sensor elements, and forming at least one optical sensor by dicing the optical sensor arrangement along the trench. Each optical sensor comprises an optical sensor element, and the light entrance surface is free of electrical contacts and at least partially free of the opaque material above the optical sensor elements. Furthermore, an optical sensor is provided.