Patent · US Active

Pressure sensor having a lidless/laminate structure

US11274984B2 · kind B2 · utility

0Cited by

1References

16Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Chau Fatt Chiang · Melaka City, MY
Paul Armand Asentista Calo · Melaka City, MY
Chan Lam Cha · Melaka City, MY
Kok Yau Chua · Melaka City, MY
Jo Ean Chye · Bukit Mertajam, MY
Chee Hong Lee · 流花街道, CN
Swee Kah Lee · Melaka City, MY
Theng Chao Long · Melaka City, MY
Jayaganasan Narayanasamy · Pantai Belimbing, MY
Khay Chwan Saw · Melaka City, MY

Key dates

Filing date	Jun 2, 2020
Grant date	Mar 15, 2022
Priority date	—
Expiry date	Jul 9, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2201/003
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.