Chan Lam Cha
8Patents
1h-index
30Co-inventors
43Inventor score
Filing activity: Nov 27, 2017 → Dec 20, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11081455B2 | Semiconductor device with bond pad extensions formed on molded appendage | Electricity | 2 | Active |
| US10396018B2 | Multi-phase half bridge driver package and methods of manufacture | Electricity | 1 | Active |
| US11469161B2 | Lead frame-based semiconductor package | Electricity | 0 | Active |
| US11274984B2 | Pressure sensor having a lidless/laminate structure | Electricity | 0 | Active |
| US12300559B2 | Semiconductor packages and methods for manufacturing thereof | Electricity | 0 | Active |
| US11217511B2 | Quad package with conductive clips connected to terminals at upper surface of semiconductor die | Electricity | 0 | Active |
| US12278171B2 | Chip package and method of forming a chip package | Electricity | 0 | Active |
| US12176222B2 | Semiconductor package with metal posts from structured leadframe | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.