Patent · US Active

Device and method for bonding of two substrates

US11276589B2 · kind B2 · utility

2Cited by

6References

15Claims

0Family size

Assignee

EV GROUP E. THALLNER GMBH · AT

Inventors

Markus Wimplinger · Ried im Innkreis, AT
Florian Kurz · Ried im Innkreis, AT
Viorel Dragoi · Ried im Innkreis, AT

Key dates

Filing date	Feb 22, 2021
Grant date	Mar 15, 2022
Priority date	—
Expiry date	Feb 22, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68735
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.