Methods of forming flexure based cooling solutions for package structures
US11276625B2 · kind B2 · utility
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4References
25Claims
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Key dates
| Filing date | Sep 29, 2016 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Feb 8, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods/structures of joining package structures are described. Those methods/structures may include a first side of a die disposed on a first side of a substrate, and a cooling structure on a second side of the die, wherein the cooling structure comprises a first section attached to the substrate, and a second section disposed on a second side of the die, wherein the first and second sections are separated by an opening in the cooling structure. The opening surrounds a portion of the second section, and at least one flexure beam structure connects the first and second sections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.