Bonding dummy electrodes of light emitting diode chip to substrate
US11276672B1 · kind B1 · utility
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2References
10Claims
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Assignee
Inventors
Key dates
| Filing date | Oct 8, 2019 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Mar 22, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting diode (LED) chip is bonded to a substrate. The LED chip includes one or more dummy electrodes that corresponds to one or more contacts on the substrate. The one or more dummy electrodes are exposed to a laser beam for coupling the one or more dummy electrodes to the one or more contacts. The one or more dummy electrodes may be positioned along edges of the LED chip that surround a display area of the LED chip and provide bonding strength between the LED chip and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.