Re-entrant flow cold plate
US11277937B2 · kind B2 · utility
6Cited by
18References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2020 |
| Grant date | Mar 15, 2022 |
| Priority date | — |
| Expiry date | Jul 30, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20272
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A fluid-cooled re-entrant cold plate for thermal management of heat dissipating electronic devices or assemblies. The fluid leaves the cold plate's outer perimeter, fills a sealed cavity between the cold plate outer perimeter and the mating component/assembly, provides direct cooling of the electronic component, then re-enters the cold plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.