Placement apparatus and processing apparatus
US11280002B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2019 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | Jan 13, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/466
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A placement apparatus is provided in the present disclosure. The apparatus includes a stage on which a substrate is placed; a support configured to support the stage from a side of a rear surface of the stage that is opposite to a placement surface on which the substrate is placed; a temperature adjustment member including a plate securing the stage from a lower surface of the stage, a shaft extending downwards from the plate, and a hole accommodating the support through the shaft from the plate, and being capable of a temperature adjustment; a heat-insulating member disposed between the stage and the temperature adjustment member; and an abutment member configured to abut the substrate placed on the stage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.