Method for via formation by micro-imprinting

US11281094B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Roman Gouk · San Jose, US
• Giback Park · San Jose, US
• Kyuil Cho · Santa Clara, US
• Han-Wen Chen · San Mateo, US
• Chintan Buch · Santa Clara, US
• Steven Verhaverbeke · San Francisco, US
• Vincent DiCaprio · Pleasanton, US

Key dates

• Filing date: Nov 15, 2018
• Grant date: Mar 22, 2022
• Expiry date: Feb 8, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76817
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A method and apparatus for forming a plurality of vias in panels for advanced packaging applications is disclosed, according to one embodiment. A redistribution layer is deposited on a substrate layer. The redistribution layer may be deposited using a spin coating process, a spray coating process, a drop coating process, or lamination. The redistribution layer is then micro-imprinted using a stamp inside a chamber. The redistribution layer and the stamp are then baked inside the chamber. The stamp is removed from the redistribution layer to form a plurality of vias in the redistribution layer. Excess residue built-up on the redistribution layer may be removed using a descumming process. A residual thickness layer disposed between the bottom of each of the plurality of vias and the top of the substrate layer may have thickness of less than about 1 μm.