Enlarged conductive pad structures for enhanced chip bond assembly yield
US11282773B2 · kind B2 · utility
1Cited by
11References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2020 |
| Grant date | Mar 22, 2022 |
| Priority date | — |
| Expiry date | Apr 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrical device includes an electrically insulating body having an insulating body surface and a conductive pad array, a small conductive pad arranged on the insulating body surface and within the conductive pad array, and an enlarged conductive pad. The enlarged conductive pad is arranged on the insulating body and within the conductive pad array, wherein the enlarged conductive pad is spaced apart from the small conductive pad and is larger than the small conductive pad. C4 assemblies and methods of making C4 assemblies including the electrical device are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.