System for direct writing on an uneven surface of a workpiece that is covered with a radiation sensitive layer using exposures having different focal planes

US11284517B2 · kind B2 · utility

Assignee

• MICRONIC MYDATA AB · SE

Inventors

• Per Askebjer · Åkersberga, SE
• Mats Rosling · Täby, SE

Key dates

• Filing date: Dec 3, 2018
• Grant date: Mar 22, 2022
• Expiry date: Jun 9, 2040

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49155
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

The technology disclosed relates to accommodating embedded substrates during direct writing onto a printed circuit board and to other patterning problems that benefit from an extended depth of focus. In particular, it relates to multi-focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes. In one implementation, a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes.