Thin film fluoropolymer composite CMP polishing method

US11285577B2 · kind B2 · utility

Assignee

• Rohm and Haas Electronic Materials CMP Holdings, Inc. · US

Inventors

• Mohammad T. Islam · Middletown, US
• Nan-Rong Chiou · Wilmington, US
• Matthew R. Gadinski · Nonatum Mills, US
• Youngrae Park · Wilmington, US
• Gregory Scott Blackman · Media, US
• Lei Zhang · Hockessin, US
• George C. Jacob · Newark, US

Key dates

• Filing date: Jun 10, 2019
• Grant date: Mar 29, 2022
• Expiry date: Mar 7, 2040

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L2205/14
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The invention provides a polymer-polymer composite polishing method comprising a polishing layer having a polishing surface for polishing or planarizing a substrate. The method includes attaching a polymer-polymer composite having a polishing layer and a polymeric matrix. The polymer matrix has fluoropolymer particles embedded in the polymeric matrix. Then a cationic particle slurry is applied to the polymer-polymer composite polishing pad. Conditioning the polymer-polymer composite polishing pad with an abrasive cuts the polymer-polymer composite polishing pad; and rubbing the cut polymer-polymer composite polishing pad against the substrate forms the polishing surface. The polishing surface has a fluorine concentration measured in atomic percent at a penetration depth of 1 to 10 nm of at least ten percent higher than the bulk fluorine concentration measured with at a penetration depth of 1 to 10 μm to polish or planarize the substrate.