Method for fabricating electronic package
US11289346B2 · kind B2 · utility
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4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2020 |
| Grant date | Mar 29, 2022 |
| Priority date | — |
| Expiry date | Jul 2, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package and a method for fabricating the same are provided. The method includes: forming a circuit structure on an encapsulant; embedding a first electronic component and a plurality of conductive posts in the encapsulant; and disposing a second electronic component on the circuit structure. Since the first and second electronic components are arranged on opposite sides of the circuit structure, the electronic package can provide multi-function and high efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.