Patent · US Active

Semiconductor package having a laser-activatable mold compound

US11289436B2 · kind B2 · utility

0Cited by

20References

13Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Chee Hong Lee · 流花街道, CN
Kok Yau Chua · Melaka City, MY
Chii Shang Hong · Melaka City, MY
Swee Kah Lee · Melaka City, MY
Chee Yang Ng · Kluang, MY
Klaus Schiess · Allensbach, DE

Key dates

Filing date	May 28, 2020
Grant date	Mar 29, 2022
Priority date	—
Expiry date	May 28, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/18161
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of molded packages and corresponding methods of manufacture are provided. In an embodiment of a molded package, the molded package includes a laser-activatable mold compound having a plurality of laser-activated regions which are plated with an electrically conductive material to form metal pads and/or metal traces at a first side of the laser-activatable mold compound. A semiconductor die embedded in the laser-activatable mold compound has a plurality of die pads. An interconnect electrically connects the plurality of die pads of the semiconductor die to the metal pads and/or metal traces at the first side of the laser-activatable mold compound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.