Chemical mechanical polishing using time share control
US11298794B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2019 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Jan 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of chemical mechanical polishing includes rotating a polishing pad about an axis of rotation, positioning a substrate against the polishing pad, the polishing pad having a groove that is concentric with the axis of rotation, oscillating the substrate laterally across the polishing pad such that a central portion of the substrate and an edge portion of the substrate are positioned over a polishing surface of the polishing pad for a first duration, and holding the substrate substantially laterally fixed in a position such that the central portion of the substrate is positioned over the polishing surface of the polishing pad and the edge portion of the substrate is positioned over the groove for a second duration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.