Wei Lu
14Patents
2h-index
23Co-inventors
54Inventor score
Filing activity: Jul 14, 2004 → Nov 9, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7543289B2 | Method for accessing and collaborating between servlets located on different Java virtual machines | Electricity | 13 | Active |
| US8066552B2 | Multi-layer polishing pad for low-pressure polishing | Performing Operations; Transporting | 6 | Active |
| US11951589B2 | Wafer edge asymmetry correction using groove in polishing pad | Performing Operations; Transporting | 2 | Active |
| US11298794B2 | Chemical mechanical polishing using time share control | Electricity | 2 | Active |
| US7682457B2 | Frontside structure damage protected megasonics clean | Emerging Cross-Sectional Technologies | 2 | Active |
| US11728185B2 | Steam-assisted single substrate cleaning process and apparatus | Electricity | 1 | Active |
| US11823916B2 | Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning | Electricity | 0 | Active |
| US11931854B2 | Chemical mechanical polishing using time share control | Electricity | 0 | Active |
| US12285838B2 | Wafer edge asymmetry correction using groove in polishing pad | Performing Operations; Transporting | 0 | Active |
| US12106976B2 | Steam-assisted single substrate cleaning process and apparatus | Electricity | 0 | Active |
| US12400881B2 | Apparatus and method of substrate edge cleaning and substrate carrier head gap cleaning | Electricity | 0 | Active |
| US11780045B2 | Compensation for substrate doping for in-situ electromagnetic inductive monitoring | Physics | 0 | Active |
| US11883923B2 | Chemical mechanical polishing using time share control | General | 0 | Revoked |
| US8387042B2 | Remote servlets collaboration | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.