Semiconductor packaging structure and method for packaging semiconductor device
US11302539B2 · kind B2 · utility
0Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2020 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Aug 7, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/562
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for packaging a semiconductor device includes the steps of: disposing a wafer on a first carrier plate; attaching a second carrier plate to a side of the first carrier plate opposite to the wafer; disposing a chip unit on a side of the wafer opposite to the first carrier plate; and covering the wafer and the chip unit with an encapsulation layer. A semiconductor packaging structure is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.