Chun-Te Lin
27Patents
3h-index
27Co-inventors
63Inventor score
Filing activity: Oct 9, 2001 → Feb 21, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD939024S1 | Electronic gaming cabin | General | 8 | Active |
| USD935399S1 | Wireless charging stand for catholic smart rosary | General | 5 | Active |
| USD955383S1 | Computer host | General | 5 | Active |
| US6541834B1 | Silicon pressure micro-sensing device and the fabrication process | Performing Operations; Transporting | 3 | Expired |
| US6743075B2 | Method for determining chemical mechanical polishing time | Electricity | 3 | Expired |
| US8531009B2 | Package structure of three-dimensional stacking dice and method for manufacturing the same | Electricity | 2 | Active |
| USD1038114S1 | Notebook computer | General | 2 | Active |
| US10607860B2 | Package structure and chip structure | Electricity | 2 | Active |
| USD1022973S1 | Antenna | General | 1 | Active |
| US7358168B2 | Ion implantation method for forming a shallow junction | Electricity | 1 | Expired |
| USD1041465S1 | Notebook computer | General | 1 | Active |
| USD1024021S1 | Controller | General | 1 | Active |
| US9618990B2 | Electronic device and power management method thereof | Emerging Cross-Sectional Technologies | 1 | Active |
| US10276510B2 | Manufacturing method of package structure having conductive shield | Electricity | 1 | Active |
| US9825010B2 | Stacked chip package structure and manufacturing method thereof | Electricity | 1 | Active |
| USD1032583S1 | Router | General | 1 | Active |
| USD1078748S1 | Mouse pad | General | 0 | Active |
| USD998278S1 | Catholic smart rosary | General | 0 | Active |
| US7192789B2 | Method for monitoring an ion implanter | Electricity | 0 | Expired |
| US8122241B2 | Method for delivering a confidential e-mail | Electricity | 0 | Active |
| US11302539B2 | Semiconductor packaging structure and method for packaging semiconductor device | Electricity | 0 | Active |
| US11694950B2 | Semiconductor package | Electricity | 0 | Active |
| US10950557B2 | Stacked chip package structure and manufacturing method thereof | Electricity | 0 | Active |
| USD1072975S1 | Exercise equipment | General | 0 | Active |
| US11362055B2 | Bump structure of the semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.