Transfer elements that selectably hold and release objects based on changes in stiffness
US11302561B2 · kind B2 · utility
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8References
22Claims
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Key dates
| Filing date | Nov 12, 2019 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Jan 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Transfer elements include an adhesion element having a higher Young's modulus at a lower temperature and a lower Young's modulus at a higher temperature. Heating elements are operable to change an operating temperature of each adhesion element in response to an input. A controller is coupled to provide the inputs to the heating elements to cause a change in temperature at least between the higher and lower temperature. The change in temperature causes the transfer elements to selectably hold objects to and release the objects in response to changes between the higher and lower Young's moduli of transfer elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.