Laminated stiffener to control the warpage of electronic chip carriers
US11302651B2 · kind B2 · utility
1Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2019 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Oct 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.