Process for manufacturing an LED-based emissive display device
US11302677B2 · kind B2 · utility
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18Claims
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Key dates
| Filing date | Sep 3, 2018 |
| Grant date | Apr 12, 2022 |
| Priority date | — |
| Expiry date | Apr 28, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing an LED display device, including the successive steps of: a) transferring, onto a planar surface of a support plate made of a transparent material having its other surface structured and defining a plurality of microlenses, a plurality of semiconductor chips, each including at least one LED; and b) forming a network of conductive interconnection tracks contacting the chips by their surface opposite to the support plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.