Semiconductor device with metal spacers and method for fabricating the same
US11309245B2 · kind B2 · utility
1Cited by
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19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 28, 2019 |
| Grant date | Apr 19, 2022 |
| Priority date | — |
| Expiry date | Jan 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/485
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate having a plurality of contacts, a plurality of plugs positioned above the plurality of contacts, a plurality of metal spacers positioned above the plurality of plugs; and a plurality of air gaps respectively positioned between the plurality of metal spacers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.