Patent · US Active

Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate

US11309277B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Petteri Palm · Regensburg, DE
Thorsten Scharf · Regensburg, DE
Ralf Wombacher · Burglengenfeld, DE

Key dates

Filing date	Jun 17, 2020
Grant date	Apr 19, 2022
Priority date	—
Expiry date	Jun 17, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/13091
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Electronic module, which comprises a first substrate, a first dielectric layer on the first substrate, at least one electronic chip, which is mounted with a first main surface directly or indirectly on partial region of the first dielectric layer, a second substrate over a second main surface of the at least one electronic chip, and an electrical contacting for the electric contact of the at least one electronic chip through the first dielectric layer, wherein the first adhesion layer on the first substrate extends over an area, which exceeds the first main surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.