Adaptive geometry for optimal focused ion beam etching

US11315754B2 · kind B2 · utility

Assignee

• Applied Materials Israel Ltd. · IL

Inventors

• Ilya Blayvas · Jerusalem, IL
• Gal Bruner · Nahariah, IL
• Yehuda Zur · Nes Ziona, IL
• Alexander Mairov · Herzliya, IL
• Ron Davidescu · Gdera, IL
• Kfir Dotan · Nes Ziona, IL
• Alon Litman · Nes Ziona, IL

Key dates

• Filing date: Apr 27, 2020
• Grant date: Apr 26, 2022
• Expiry date: Apr 27, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J2237/31749
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method of evaluating a region of a sample that includes alternating layers of different material. The method includes milling, with a focused ion beam, a portion of the sample that includes the alternating layers of different material; reducing the milling area; and repeating the milling and reducing steps multiple times during the delayering process until the process is complete.