Batch heating and cooling chamber or loadlock

US11315806B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Jason M. Schaller · Austin, US
• Robert Brent Vopat · Austin, US
• Paul E. Pergande · Beverly Hills, US
• Benjamin B. Riordon · Newburyport, US
• David Blahnik · Round Rock, US
• William T. Weaver · Austin, US

Key dates

• Filing date: May 1, 2019
• Grant date: Apr 26, 2022
• Expiry date: Jan 20, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68742
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.