Wire embedding system with a curved delivery path
US11317515B2 · kind B2 · utility
1Cited by
1References
17Claims
0Family size
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Key dates
| Filing date | Sep 5, 2017 |
| Grant date | Apr 26, 2022 |
| Priority date | — |
| Expiry date | Mar 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for embedding a line in a substrate. A line embedding head in positioned relative to a surface of the substrate. The line from an output port in the line embedding head is output at an angle relative to the embedding head such that the line is embedded in the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.