Three-dimensional thermal management apparatuses for electronic devices
US11328976B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2020 |
| Grant date | May 10, 2022 |
| Priority date | — |
| Expiry date | May 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2023/4081
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some examples described herein provide for three-dimensional (3D) thermal management apparatuses for thermal energy dissipation of thermal energy generated by an electronic device. In an example, an apparatus includes a thermal management apparatus that includes a primary base, a passive two-phase flow thermal carrier, and fins. The thermal carrier has a carrier base and one or more sidewalls extending from the carrier base. The carrier base and the one or more sidewalls are a single integral piece. The primary base is attached to the thermal carrier. The carrier base has an exterior surface that at least a portion of which defines a die contact region. The thermal carrier has an internal volume aligned with the die contact region. A fluid is disposed in the internal volume. The fins are attached to and extend from the one or more sidewalls of the thermal carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.