Hoa Do
9Patents
3h-index
17Co-inventors
54Inventor score
Filing activity: Apr 22, 2003 → Apr 9, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6744131B1 | Flip chip integrated circuit packages accommodating exposed chip capacitors while providing structural rigidity | Electricity | 5 | Expired |
| US11950954B2 | Intravascular ultrasound patient interface module (PIM) for distributed wireless intraluminal imaging systems | Human Necessities | 4 | Active |
| US11373929B1 | Thermal heat spreader plate for electronic device | Electricity | 4 | Active |
| US12112850B2 | Functional measurement patient interface module (PIM) for distributed wireless intraluminal sensing systems | Human Necessities | 2 | Active |
| US11328976B1 | Three-dimensional thermal management apparatuses for electronic devices | Electricity | 2 | Active |
| US11246211B1 | Micro device with through PCB cooling | Electricity | 2 | Active |
| US11488887B1 | Thermal enablement of dies with impurity gettering | Electricity | 1 | Active |
| US12383225B2 | Intravascular ultrasound patient interface module (PIM) for distributed wireless intraluminal imaging systems | Human Necessities | 0 | Active |
| US12324101B2 | Frame for coupling of a thermal management device to a printed circuit board | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.