Package inductor having thermal solution structures
US11335620B2 · kind B2 · utility
3Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2018 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Sep 15, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments include a microelectronic device package structure having an inductor at least partially embedded within a substrate. At least one thermal solution structure may be on a surface of the inductor, and may be thermally coupled with the inductor. The one or more thermal solution structures provide a thermal pathway for cooling for the inductor, and extend a thermal time constant of the inductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.