Hybrid structure for a surface acoustic wave device
US11335847B2 · kind B2 · utility
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1References
16Claims
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Key dates
| Filing date | Jan 17, 2017 |
| Grant date | May 17, 2022 |
| Priority date | — |
| Expiry date | Apr 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/708
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The disclosure relates to a hybrid structure for a surface-acoustic-wave device comprising a useful layer of piezoelectric material joined to a carrier substrate having a thermal expansion coefficient lower than that of the useful layer; the hybrid structure comprising an intermediate layer located between the useful layer and the carrier substrate, the intermediate layer being a structured layer formed from at least two different materials comprising a plurality of periodic motifs in the plane of the intermediate layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.