Eric Butaud
4Patents
1h-index
9Co-inventors
37Inventor score
Filing activity: Jan 14, 2013 → Jan 31, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9911641B2 | Process for manufacturing a semiconductor substrate, and semiconductor substrate obtained | Electricity | 1 | Active |
| US12424995B2 | Method for manufacturing a structure comprising a thin layer transferred onto a support provided with a charge trapping layer | Electricity | 0 | Active |
| US11335847B2 | Hybrid structure for a surface acoustic wave device | Electricity | 0 | Active |
| US12108678B2 | Hybrid structure for a surface acoustic wave device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.