Patent · US Active

Heated shield for physical vapor deposition chamber

US11339466B2 · kind B2 · utility

0Cited by

5References

20Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Ilya Lavitsky · San Francisco, US
Keith A. Miller · Schererville, US
Goichi Yoshidome · Emeryville, US

Key dates

Filing date	Mar 20, 2020
Grant date	May 24, 2022
Priority date	—
Expiry date	May 28, 2040

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC23C14/50
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Embodiments of a process shield for use in a process chamber are provided herein. In some embodiments, a process shield for use in a process chamber includes a body having a cylindrical shape, wherein the body includes an upper portion and a lower portion, the upper portion having an outer lip and the lower portion extending downward and radially inward from the upper portion, wherein the outer lip includes a plurality of openings to accommodate fasteners, a plurality of alignment slots extending radially inward from an outer surface of the outer lip, and a notched lower peripheral edge, and wherein a lower surface of the outer lip includes a plurality of grooves.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.