Semiconductor wafer processing chamber
US11342215B2 · kind B2 · utility
1Cited by
64References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2018 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Sep 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A housing of a wafer processing system includes at least one chamber exhaust outlet and at least one chemical exhaust outlet. The chamber exhaust outlet is formed in the housing for venting gas from the interior of the housing and the chemical exhaust outlet is formed in the housing for venting gas that flows along at least one of: (a) a first flow path defined between the splash shield in a raised position and the collection trays in the lowered position; and (b) a second flow path in which the gas flows through the collection chamber to the chemical exhaust outlet.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.