Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same
US11342277B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 10, 2020 |
| Grant date | May 24, 2022 |
| Priority date | — |
| Expiry date | Jun 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device assembly is provided. The assembly includes a substrate including an upper surface having a plurality of internal contact pads and at least one grounding pad and a lower surface having a plurality of external contact pads. The assembly further includes a semiconductor die coupled to the plurality of internal contact pads, a conductive underfill dam coupled to the at least one grounding pad, and underfill material disposed at least between the semiconductor die and the substrate. The underfill material includes a fillet between the semiconductor die and the underfill dam. The assembly further includes a conductive EMI shield disposed over the semiconductor die, the fillet, and the conductive underfill dam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.