Jungbae Lee
15Patents
2h-index
9Co-inventors
39Inventor score
Filing activity: Aug 6, 2018 → Oct 18, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10559550B2 | Memory device including heterogeneous volatile memory chips and electronic device including the same | Electricity | 8 | Active |
| US11688706B2 | Semiconductor device assembly with embossed solder mask having non-planar features and associated methods and systems | Electricity | 2 | Active |
| US11532595B2 | Stacked semiconductor dies for semiconductor device assemblies | Electricity | 1 | Active |
| US11887938B2 | Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same | Electricity | 1 | Active |
| US11342277B2 | Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same | Electricity | 1 | Active |
| US11094668B2 | Solderless interconnect for semiconductor device assembly | Electricity | 1 | Active |
| US11810894B2 | Solderless interconnect for semiconductor device assembly | Electricity | 0 | Active |
| US11942455B2 | Stacked semiconductor dies for semiconductor device assemblies | Electricity | 0 | Active |
| US11362071B2 | Stacked semiconductor dies for semiconductor device assemblies | Electricity | 0 | Active |
| US11923332B2 | Semiconductor die with capillary flow structures for direct chip attachment | Electricity | 0 | Active |
| US11404289B2 | Semiconductor device assembly with graded modulus underfill and associated methods and systems | Electricity | 0 | Active |
| US11682563B2 | Semiconductor device assembly with graded modulus underfill and associated methods and systems | Electricity | 0 | Active |
| US11621245B2 | Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems | Electricity | 0 | Active |
| US11264349B2 | Semiconductor die with capillary flow structures for direct chip attachment | Electricity | 0 | Active |
| US12341128B2 | Stacked semiconductor dies for semiconductor device assemblies | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.