Patent · US Active

Flexible interconnect using conductive adhesive

US11349053B1 · kind B1 · utility

2Cited by

5References

20Claims

0Family size

Assignee

Facebook Technologies, LLC · US

Inventors

Zheng Sung Chio · Cork, IE
Daniel Brodoceanu · Cork, IE
Ali Sengül · Zürich, CH
Oscar Torrents Abad · Cork, IE
Jeb Wu · Redmond, US
Pooya Saketi · Cork, IE
Chao Kai Tung · Cork, IE
Tennyson Nguty · Cork, IE
Allan Pourchet · Cork, IE

Key dates

Filing date	Jan 14, 2020
Grant date	May 31, 2022
Priority date	—
Expiry date	Sep 17, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/0364
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments relate to the design of an electronic device capable having flexible interconnects that connect together a first body and a second body of the electronic device. The flexible interconnects allow the electrical device to better withstand thermal-mechanical stress during fabrication of the electronic device and user usage of the electronic device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.