Patent · US Active

Electronic device and corresponding manufacturing method

US11352251B2 · kind B2 · utility

0Cited by
1References
15Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 26, 2020
Grant dateJun 7, 2022
Priority date—
Expiry dateOct 10, 2040

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/1615
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An electronic integrated circuit (IC) component is mounted to a substrate. A cap member is applied onto the substrate and covers the electronic IC component. The cap member includes an outer wall defining an opening and an inner wall surrounding the electronic IC component. The inner wall extends from a proximal end at the substrate towards a distal end facing the opening in the outer wall to provide a reception chamber for the electronic IC component and a peripheral chamber between the inner wall and the outer wall of the cap member. An encapsulant material is provided in the reception chamber to seal the electronic IC component without being present in the peripheral chamber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.