Robot for simultaneous substrate transfer

US11355367B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Jason M. Schaller · Austin, US
• Charles T. Carlson · Cedar Park, US
• Luke Bonecutter · Cedar Park, US
• David Blahnik · Round Rock, US
• Karuppasamy Muthukamatchi · Madurai, IN
• Jeff Hudgens · San Francisco, US
• Benjamin B. Riordon · Newburyport, US

Key dates

• Filing date: Jul 7, 2020
• Grant date: Jun 7, 2022
• Expiry date: Jul 7, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67742
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Exemplary substrate processing systems may include a transfer region housing defining a transfer region, and including substrate supports and a transfer apparatus. The transfer apparatus may include a central hub having a housing, and including a first shaft and a second shaft. The housing may be coupled with the second shaft, and may define an internal housing volume. The transfer apparatus may include a plurality of arms equal to a number of substrate supports of the plurality of substrate supports. Each arm of the plurality of arms may be coupled about an exterior of the housing. The transfer apparatus may include a plurality of arm hubs disposed within the internal housing volume. Each arm hub of the plurality of arm hubs may be coupled with an arm of the plurality of arms through the housing. The arm hubs may be coupled with the first shaft of the central hub.