Batch substrate support with warped substrate capability
US11361981B2 · kind B2 · utility
4Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2018 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Apr 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for supporting substrates are provided herein. In some embodiments, a substrate support for supporting a plurality of substrates includes: a plurality of substrate support elements having a ring shape configured to support a plurality of substrates in a vertically spaced apart relation; and a plurality of substrate lift elements interfacing with the plurality of substrate support elements and configured to simultaneously selectively raise or lower substrates off of or onto respective substrate support elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.