Microelectronic device assemblies and packages including multiple device stacks and related methods
US11362070B2 · kind B2 · utility
3Cited by
0References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2020 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Jul 27, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.