Inventor · Meridian, ID, US

Owen R. Fay

108Patents
10h-index
59Co-inventors
83Inventor score

Filing activity: Apr 19, 1999 → May 20, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US7015075B2 Die encapsulation using a porous carrier Electricity 173 Expired
US6953985B2 Wafer level MEMS packaging Electricity 76 Expired
US7425464B2 Semiconductor device packaging Electricity 73 Active
US7595226B2 Method of packaging an integrated circuit die Electricity 59 Active
US6930032B2 Under bump metallurgy structural design for high reliability bumped packages Electricity 26 Expired
US7078796B2 Corrosion-resistant copper bond pad and integrated device Electricity 24 Expired
US6362089B1 Method for processing a semiconductor substrate having a copper surface disposed thereon and structure formed Emerging Cross-Sectional Technologies 23 Expired
US7872332B2 Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods Electricity 14 Active
US6780751B2 Method for eliminating voiding in plated solder Electricity 12 Expired
US9418926B1 Package-on-package semiconductor assemblies and methods of manufacturing the same Electricity 11 Active
US11386004B2 Memory device interface and method Electricity 8 Active
US8435836B2 Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods Electricity 7 Active
US8659153B2 Pillar on pad interconnect structures, semiconductor dice and die assemblies including such interconnect structures, and related methods Electricity 6 Active
US10529592B2 Semiconductor device assembly with pillar array Electricity 6 Active
US9595513B2 Proximity coupling of interconnect packaging systems and methods Electricity 6 Active
US10297561B1 Interconnect structures for preventing solder bridging, and associated systems and methods Electricity 5 Active
US10032703B2 Package-on-package semiconductor assemblies and methods of manufacturing the same Electricity 4 Active
US9165888B2 Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods Electricity 4 Active
US9601374B2 Semiconductor die assembly Electricity 3 Active
US11081460B2 Methods and systems for manufacturing pillar structures on semiconductor devices Electricity 3 Active
US10872835B1 Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same Electricity 3 Active
US10381297B2 Package-on-package semiconductor assemblies and methods of manufacturing the same Electricity 3 Active
US10600750B2 Interconnect structures for preventing solder bridging, and associated systems and methods Electricity 3 Active
US11362070B2 Microelectronic device assemblies and packages including multiple device stacks and related methods Electricity 3 Active
US11456284B2 Microelectronic device assemblies and packages and related methods Electricity 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.