Encapsulation having polymer and dielectric layers for electronic displays
US11362307B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2019 |
| Grant date | Jun 14, 2022 |
| Priority date | — |
| Expiry date | Jun 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/353
Abstract
A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) separated by gaps, and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a bilayer having a plurality of polymer projections on the display layer, the plurality of polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of polymer projections and an underlying surface in the spaces between the polymer projections, the dielectric layer forming side walls along sides of the polymer projections. The side walls are aligned with the gaps between the OLEDS, and/or the encapsulation layer has multiple bilayers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.