Component and method of manufacturing a component using an ultrathin carrier
US11367654B2 · kind B2 · utility
0Cited by
25References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 15, 2019 |
| Grant date | Jun 21, 2022 |
| Priority date | — |
| Expiry date | May 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system and method for manufacturing a packaged component are disclosed. An embodiment comprises forming a plurality of components on a carrier, the plurality of components being separated from each other by kerf regions on a front side of the carrier and forming a metal pattern on a backside of the carrier, wherein the metal pattern covers the backside of the carrier except over regions corresponding to the kerf regions. The method further comprises generating the component by separating the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.