Diamond composite CMP pad conditioner
US11370082B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2017 |
| Grant date | Jun 28, 2022 |
| Priority date | — |
| Expiry date | Jun 4, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D18/0054
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical-mechanical polishing/planarization pad conditioner body made from diamond-reinforced reaction bonded silicon carbide, with diamond particles protruding or “standing proud” of the rest of the surface, and uniformly distributed on the cutting surface. In one embodiment, the diamond particles are approximately uniformly distributed throughout the composite, but in other embodiments they are preferentially located at and near the conditioning surface. The tops of the diamond particles can be engineered to be at a constant elevation (i.e., the conditioner body can be engineered to be very flat). Exemplary shapes of the body may be disc or toroidal. The diamond particles can be made to protrude from the conditioning surface by preferentially eroding the Si/SiC matrix. The eroding may be accomplished by electrical discharge machining or by lapping/polishing with abrasive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.