Patent · US Active

Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing

US11373890B2 · kind B2 · utility

1Cited by
1References
8Claims
0Family size

Assignee

Inventor

Key dates

Filing dateDec 4, 2019
Grant dateJun 28, 2022
Priority date—
Expiry dateDec 25, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/6875
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Embodiments disclosed herein include an apparatus for measuring chucking force and methods of using such apparatuses. In an embodiment, the apparatus for measuring a chucking force comprises a substrate having a chucking surface, where the chucking surface is the surface that is supported by a chuck. In an embodiment, the apparatus further comprises a plurality of sensors over the chucking surface, where the plurality of sensors are thin film sensors with a thickness that is less than a thickness of the substrate. In an embodiment, the apparatus further comprises a wireless communication module electrically coupled to each of the plurality of sensors.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.