Thermal heat spreader plate for electronic device
US11373929B1 · kind B1 · utility
4Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2020 |
| Grant date | Jun 28, 2022 |
| Priority date | — |
| Expiry date | Jul 19, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling plate assembly and electronic device having the same are provided which utilize active and passive cooling devices for improved thermal management of one or more chip package assemblies included in the electronic device. In one example, a cooling plate assembly is provided that includes a cooling plate having a first surface and an opposing second surface, a first active cooling device coupled to the first surface of the cooling plate, and a first passive cooling device coupled to the second surface of the cooling plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.