Semiconductor devices
US11373942B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2020 |
| Grant date | Jun 28, 2022 |
| Priority date | — |
| Expiry date | Jul 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15173
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises a substrate, a semiconductor chip on the substrate, and first and second leads between the substrate and the semiconductor chip. The first and second leads extend from an edge of the substrate toward below the semiconductor chip along a first direction parallel to a top surface of the substrate. The first lead includes a first bump connector and a first segment. The second lead includes a second bump connector. The first bump connector is spaced apart in the first direction from the second bump connector. The first segment of the first lead is spaced apart in a second direction from the second bump connector. The second direction is parallel to the top surface of the substrate and perpendicular to the first direction. A thickness of the first segment of the first lead is less than that of the second bump connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.