Methods and apparatus for processing a substrate using microwave energy
US11375584B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2019 |
| Grant date | Jun 28, 2022 |
| Priority date | — |
| Expiry date | Aug 24, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B6/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for processing a substrate are provided herein. The apparatus can include, for example, a microwave energy source configured to provide microwave energy from beneath a substrate support provided in an inner volume of the process chamber; a first microwave reflector positioned on the substrate support above a substrate supporting position of the substrate support; and a second microwave reflector positioned on the substrate support beneath the substrate supporting position, wherein the first microwave reflector and the second microwave reflector are positioned and configured such that microwave energy passes through the second microwave reflector and some of the microwave energy is reflected from a bottom surface of the first microwave reflector back to the substrate during operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.