Deposition of organic films

US11387107B2 · kind B2 · utility

Assignee

• ASM IP Holding B.V. · NL

Inventors

• Eva Tois · Helsinki, FI
• Hidemi Suemori · Helsinki, FI
• Viljami Pore · Helsinki, FI
• Suvi Haukka · Helsinki, FI
• Varun Sharma · Helsinki, FI

Key dates

• Filing date: Oct 23, 2020
• Grant date: Jul 12, 2022
• Expiry date: Oct 23, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76834
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Processes are provided herein for deposition of organic films. Organic films can be deposited, including selective deposition on one surface of a substrate relative to a second surface of the substrate. For example, polymer films may be selectively deposited on a first metallic surface relative to a second dielectric surface. Selectivity, as measured by relative thicknesses on the different layers, of above about 50% or even about 90% is achieved. The selectively deposited organic film may be subjected to an etch process to render the process completely selective. Processes are also provided for particular organic film materials, independent of selectivity.